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New solder paste from Heraeus

Heraeus has developed a new no-clean solder paste SOP 911 21.  

The paste has a new flux which promotes outstanding wetting and minimizes soldering defects. It has very good printing properties and long ”stencil life” for over one day.

Microbond SOP 91121 is available as type 3 and type 4 and in different alloys SAC 305, 307, 105. More information and produkct sheet

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