The MY700 high-speed jet dispensing platform for solder paste and a wide range of assembly fluids, incorporates three highly productive machine models, each one with its own set of unique capabilities.
Using a revolutionary new technology for solder paste application, the MY600 shoots solder paste on the fly without touching the PCB. Because it needs no stencils, it offers many advantages over the standard screen printer – like more PCB design freedom and virtually no changeover or lead times. Solder paste deposits can be adjusted on-the-spot in three dimensions.
My600 Key benefits